Boron CLS Bond™ technology process Step by Step

Step1:
Boric Acid is introduced

Step 2:
Interaction between Boric Acid, water
vapor and metallic substrate forms Boric
Oxide

Step 3:
Boric Oxide forms a corrosion and deposit
formation barrier
Boric acid is introduced to a metallic substrate in the presence of water vapor. Interaction between the metal substrate, the water (H2O), and Boric Acid (H3BO3) forms a continuously selfreplenishing film of boric oxide (B2O3) that bonds to the metal substrate, forming a corrosion-resistant barrier.

Step 4:
Interaction between Boric Oxide and Air
forms Boric Acid

Step 5:
Low friction Boric Acid platelets form
The boric oxide spontaneously reacts with the air, replenishing the boric acid. The boric acid molecules form into crystal platelets, each of which is a triclinic lattice of molecules strongly bound together by macromolecular covalent bonds (microscopic photo at left).

Step 6:
Platelets align parallel to the metal surface and conform to the direction of movement
Aligned by the mechanical motion of the substrate, the platelets form stacked layers with very small (0.318 nm) spaces between. As a result, the inter-platelet layers are bound by weak "van der Waals" forces, allowing a very low coefficient of friction.

And prevent metal-to-metal contact when
load is applied
Each platelet has strong intra-molecule bonding, giving it the
equivalent of 85 per cent of the hardness of diamonds.

Step 7:
Self-renewing cycle
Minute amounts of by-product boric oxide cause any sheared platelets to be rapidly replaced in a self-renewing cycle of solid lubricant-to-metal surface regeneration and bonding.